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Get the full picture for 3D surface metrology
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Get the Full Picture for 3D Surface Metrology Highly accurate surface analysis is essential in industry and research to help ensure optimal performance of materials and components. But there are challenges: surfaces can be made up of intricate structures with highly sloping areas demanding lateral resolution of a few microns, or critical micro peaks and valleys requiring vertical analysis on the sub-nanometer scale. While confocal microscopy offers high lateral resolution, interferometry is required to reach sub-nanometer vertical resolution. This is why the Leica DCM8 unites both...
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Leica DCM8 Get the full picture for 3D surface metrology “Thanks to the Leica DCM system we can now offer topographic measurement services for the first time. As a result we have gained a number of new projects and customers.” Stephan Ramseyer, IMA, Haute Ecole Arc Ingénierie, La Chaux-de-Fonds, Switzerland Read more about 3D surface metrology applications or share your expertise with our community www.leica-microsystems.com/science-lab Shown with optional antivibration ta
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Versatile and Accurate – to Meet Your Specific Surface Metrology Needs The Leica DCM8 unites the advantages of HD confocal microscopy and interferometry with a wealth of additional features that facilitate the accurate and reproducible characterization of multiple material surfaces. To meet your documentation needs, the system delivers impressive true color imaging thanks to its integrated Megapixel CCD camera and 4 LED light sources. Optimal lateral resolution with HD confocal microscopy With confocal technology even surfaces with complex shapes or steep inclinations of up to 70° can be...
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Leica DCM8 versatile and accurate - to meet your specific surface metrology needs Optimal vertical resolution with hd interferometry When vertical resolution up to 0.1 nm is required, the Leica DCM8 interferometry mode is a perfect choice. The system is able to analyze smooth, ultra-smooth and ultra-polished surfaces, covering a wide range of applications with only one system. To meet different needs, including analysis of reflective surfaces, we offer a full range of unique high quality interferometry objectives at 10x, 20x and 50x magnification. You´ll have the choice Depending on your...
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FOUR LEDS FOR RGB HD iMAGiNG AND WiDER APPLiCATiON RANGE The Leica DCM8 includes four LEDs, blue (460 nm), green (530 nm), red (630 nm) and white (centered 550 nm). By increasing the number of colors and therefore wavelengths available, the application range is extended. For example, if you are working with semiconductor wafers and photoresist where the sample is sensitive to blue light, you can choose to use only red light for image capture. You'll have an ultra-sharp full color image at hand The RGB LEDs in combination with the HD CDD camera also enable the Leica DCM8 to produce an...
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Leica DCM8 versatile and accurate - to meet your specific surface metrology needs Graphical representation of internal elements Three methods for measuring thick and thin films The Leica DCM8 offers three alternative techniques for thickness measurements: confocal mode, interferometry mode and spectroscopic reflectometer mode. The confocal and interferometry techniques can be used to measure the thickness of a transparent layer or foil, as well as the surface of the layer substrate or layer-air interface. Options for thickness measurements include single point, profile, and topography. The...
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the right configuration and objective for your SAMPLE You´ll have optics of breathtaking quality The Leica DCM8 employs our world-renowned objectives for confocal, brightfield and darkfield, from 1.25x to 150x magnification with a wide range of working distances to meet your specific requirements. If you need to analyze your samples with the highest lateral resolution, immersion objectives with high numerical apertures are available. For analysis of a surface below a transparent layer, our purpose-designed objectives with a correction collar allow focusing through layers. We offer you...
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Leica DCM8 versatile and accurate - to meet your specific surface metrology needs Standard configuration The rotating objective nosepiece A selection of hand-polished lenses which form the core of our objectives A range of manual and motorized stages are available to suit your sample
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Fast, Simple and Durable – Less Time, Money and Effort for Maximum Results The need for reliable, precise surface characterization in any application is a prerequisite, but in manufacturing, speed is also vital in order to avoid costly interruptions in production processes. The Leica DCM8 is easy to operate and fast at acquiring surface data and images. The intuitive software also makes further analysis simple and the durable design ensures a long lifespan with minimal cost of ownership. No need to prepare samples or swap instruments By uniting confocal microscopy and interferometry with...
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Leica DCM8 Fast, simple and durable - less time, money and effort for ma ximum results capture large surfaces quickly with large fov and topograph stitching Thanks to the integrated high-resolution CCD camera, the Leica DCM8 has a very large Field of View (FOV). As a result, more of the sample surface can be captured at once, helping you to optimize your workflow efficiency. You can see it all The quality control of industrial components often requires high resolution measurement of a smaller section of the sample as well as a fast scan of a larger area. To meet this requirement, the Leica...
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1. LeicaSCAN software 2. & 3. LeicaMap software
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LEICA DCM8 FAST, SIMPLE AND DURABLE - LESS TIME, MONEY AND EFFORT FOR MAXIMUM RESULTS 13 fast and intuitive software for data acquisition and analysis The Leica DCM8 is controlled by LeicaSCAN software. This powerful software has an icon-based interface for fast, intuitive data capture and analysis. When large numbers of measurements need to be taken, LeicaSCAN offers several pre-defined recipe programs enabling one-button operation. Additionally, the Multiple Measurement Recipe (MMR) can be used to acquire measurements from different XY locations, repeat measurements in the same position,...
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