video corpo

EM TXP
1 / 10ページ

{{requestButtons}}

カタログの抜粋

EM TXP - 1

LEICA EM TXP Target surfacing system

カタログの1ページ目を開く
EM TXP - 2

LEICA EM TXP – TARGET SURFACING SYSTEM The Leica EM TXP is a unique tar- easy. Before the Leica EM TXP, get preparation device especially sawing, milling, grinding and pol- developed for cutting and polishing ishing exactly to the target was samples prior to examination by often a very time-consuming and difficult procedure as points of excels with challenging specimens interest were easily missed and where pinpointing and preparing specimens often difficult to han- barely visible targets becomes dle due to their small size. With the Leica EM TXP such samples can easily be prepared....

カタログの2ページ目を開く
EM TXP - 3

INTEGRATED VIEWING SYSTEM Stereomicroscopic target observation during the working process With the specimen pivot arm the sample can be observed during preparation at an angle between 0° and 60°, directly onto the front face, or 90° to the front face for distance determination with an eyepiece graticule. The Leica EM TXP features brilliant ring LED top light and optimized backlight illumination for excellent viewing. Viewing with full ring illumination >> Accurate location and preparation of microtargets >> In-situ observation with a stereomicroscope >> Multifunctional machine processing >>...

カタログの3ページ目を開く
EM TXP - 4

PROCESS POSSIBILITIES Once the sample is clamped into the specimen holder and inserted in the pivot arm, the specimen can be: >> milled >> sawn >> drilled >> ground >> and polished without removing the sample from the Leica EM TXP and simply changing the tools while observing the process directly through the stereomicroscope. The tool and sample are enclosed within a protective chamber with a transparent cover for safety. This prevents access to moving parts and avoids particulate matter escaping. During milling a low-noise extraction and filtration unit with a Hepa filter (optional)...

カタログの4ページ目を開く
EM TXP - 5

INTEGRATED AUTOMATIC PROCESS CONTROL Let the Leica EM TXP do the job The Leica EM TXP automatic process control mechanism saves you from time-consuming routine sample preparation: >> with the automatic E-W guiding mechanism >> with the force-regulated feed control >> with the distance or time countdown function >> with force-controlled auto-advance for core-drilling Peristaltic cooling system and level sensor for the integrated lubricant cooling system E-W guiding mechanism (manual or automatic) – Pivot arm lever – Hand wheel for manual feed in steps of 0.5, 1, 10 and 100 μm – Control panel...

カタログの5ページ目を開く
EM TXP - 6

Target preparation on surfaced sample for incident light LM and SEM All processing steps are carried out consecutively on the Leica EM TXP without removing the sample for pinpointing the area of interest via another microscope or for making any adjustments. Preparing specimens observed during operation with the integrated stereomicroscope avoids the time consuming interruption of locating the target with a stand alone microscope and then re-aligning the sample in the polishing instrument. Sample thinning for transmitted light LM or prior to ion thinning for TEM Specimen thinning with the...

カタログの6ページ目を開く
EM TXP - 7

Observation via stereo microscope of the Leica EM TXP The surface of the stub is milled with the tungsten carbide miller so it is parallel to the grinding and the polishing plane for processing the second side of the sample. The prepared first side is fixed onto the surface of the stub. The second side is then cut, ground and polished. The thickness of the sample can be determined with the advance counter display. In such a manner, ly prepared for TE Within a few minutes all sample details are aligned. LM-image of gold wire bondings processed with the cut-off wheel and ground with 6 pm...

カタログの7ページ目を開く
EM TXP - 8

Gold-wire bonding of IC-package prepared with the Leica EM TXP (LM image). Same gold wire bonding subsequently processed for half an hour with the Leica EM RES102 (SEM image). Left: Leica EM RES102 for ion beam processing of TEM and SEM samples even hard and brittle materials can be thinned to be subsequentEM investigation e.g. for ion thinning with the Leica EM RES102. gs of IC-package during processing with the Leica EM TIC 3X. ove the gold wires has already been polished by the ion beam. High surface quality within a few hours. The user interaction time of the complete process is around...

カタログの8ページ目を開く
EM TXP - 10

qualityaustria SYSTEM CERTIFIED ISO 9001:2008 No.00805/0IS014001:2004 No.02783/0 Leica Mikrosysteme GmbH | Vienna, Austria T +43 1 486 8050-0 | F +43 1 486 8050-30 www.leica-microsystems.com Leica EM TXP Brochure •English - 09/2015 • Copyright © by Leica Mikrosysteme GmbH, Vienna, Austria, 2015. Subject to modifications. LEICA and the Leica Logo are registered trademarks of Leica Microsystems IR GmbH.

カタログの10ページ目を開く

Leica Microsystems/ライカのすべてのカタログと技術パンフレット

  1. M844 F40/F20

    16 ページ

  2. EnFocus

    12 ページ

  3. M822 F40 / F20

    12 ページ

  4. M320 for ENT

    12 ページ

  5. ARveo 8

    16 ページ

  6. M320 Dental Brochure

    12 ページ

  7. Emspira 3

    4 ページ

  8. Exalta

    2 ページ

  9. FLEXACAM C1

    4 ページ

  10. EM KMR3

    8 ページ

  11. EM UC7

    16 ページ

  12. EM TRIM2

    8 ページ

  13. EM RAPID

    8 ページ

  14. EM ICE

    12 ページ

  15. EM RES102

    12 ページ

  16. EM TIC 3X

    16 ページ

  17. TL4000 BFDF

    16 ページ

  18. F12 I floor stand

    6 ページ

  19. XL Stand

    4 ページ

  20. KL300 LED

    8 ページ

  21. LED1000

    16 ページ

  22. LED3000 BLI

    20 ページ

  23. LED5000 NVI

    20 ページ

  24. LED3000 NVI

    20 ページ

  25. LED3000 DI

    20 ページ

  26. LED5000 HDI

    20 ページ

  27. LED5000 CXI

    20 ページ

  28. LED2500

    8 ページ

  29. LED5000 MCI

    20 ページ

  30. LED3000 MCI

    20 ページ

  31. LED5000 SLI

    20 ページ

  32. LED3000 SLI

    20 ページ

  33. LED2000

    8 ページ

  34. LED5000 RL

    20 ページ

  35. LED3000 RL

    20 ページ

  36. MZ10 F

    4 ページ

  37. M165 FC

    16 ページ

  38. M205 FCA, M205 FA

    16 ページ

  39. A60 F, A60 S

    16 ページ

  40. M50, M60, M80

    12 ページ

  41. DVM6

    16 ページ

  42. HCS A

    20 ページ

  43. TCS SPE

    20 ページ

  44. DFC450 C

    6 ページ

  45. DFC295

    6 ページ

  46. MC170 HD

    6 ページ

  47. DFC3000 G

    6 ページ

  48. DMC4500

    4 ページ

  49. ICC50 W, ICC50 E

    6 ページ

  50. DFC9000

    2 ページ

  51. IC90 E

    6 ページ

  52. DMC6200

    8 ページ

  53. DMC5400

    8 ページ

  54. SFL7000

    4 ページ

  55. EL6000

    4 ページ

  56. SFL100

    4 ページ

  57. SFL4000

    4 ページ

  58. DMi8 S Platform

    2 ページ

  59. DMi8 M / C / A

    12 ページ

  60. DM IL LED

    12 ページ

  61. DMi1

    6 ページ

  62. DM3 XL

    7 ページ

  63. FS M

    4 ページ

  64. FS C

    4 ページ

  65. FS CB

    4 ページ

  66. DM3000, DM3000 LED

    16 ページ

  67. DM750 M

    12 ページ

  68. DM750

    12 ページ

  69. DM500

    12 ページ

  70. DM300

    8 ページ

  71. DM12000 M

    8 ページ

  72. DM8000 M

    8 ページ

  73. DM1750 M

    12 ページ

  74. DM4 M, DM6 M

    12 ページ

  75. DM2000, DM2000 LED

    16 ページ

  76. DM1000

    16 ページ

  77. DCM8

    16 ページ

  78. DM1000 LED

    16 ページ

  79. DM2500

    16 ページ

  80. DM4 B & DM6 B

    16 ページ

  81. DM6 M LIBS

    2 ページ

  82. S9 Series

    12 ページ

  83. Z6 APO

    16 ページ

  84. Z16 APO

    16 ページ

  85. M620 F20

    8 ページ

  86. M220 F12

    8 ページ

  87. Proveo 8

    16 ページ

  88. M525 F20

    12 ページ

  89. PROvido

    8 ページ

  90. Leica M530 OHX

    16 ページ

  91. Leica AOBS

    16 ページ

  92. Leica DMC2900

    6 ページ

  93. Leica DMshare

    2 ページ

  94. Leica_SL801-Flyer

    2 ページ

  95. DM2700 M

    12 ページ