These images are cross-sectional electron micrographs taken from ultra-thin sections cut with a diamond knife on an RMC ultramicrotome. (see MT-XL and MT-X datasheets) The materials are extremely hard so sections are typically cut at a sectioning speed of 0.1mm/ sec with a section thickness of 40nm. The Power Drive© feature of our ultramicrotomes makes it possible to cut such hard materials. Cubic Boron Nitride on Silicon Bar = 25nm PS E-beam Deposited Ti02/SiO2 Optical Multilayer Bar = 25nm

Ultra-thin sectioning with an ultramicrotome is frequently used to cross-section hard semiconductor, dialectric and metal coatings used in the electronics and optics industry. This method provides a critical capability to study the structure/property relationships in thin films using Transmission Electron Microscopy and qualitative elemental analysis by EDS. Samples are typically prepared from micro-chips in the order of 1000 microns in diameter, cleaned and embedded in Spurrs epoxy resin prior to sectioning on the ultramicrotome. E-beam Evaporated Deposition of Fluoride Compound on Glass Substrate...