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Matsci-B1

Product catalog summary

Introduction
This bulletin discusses the application of ultramicrotomy in the preparation of thin film coatings for materials science applications. The technique involves using a diamond knife on an RMC ultramicrotome to cut ultra-thin sections for electron microscopy analysis.

Specifications
The sections are cut at a speed of 0.1mm/sec with a thickness of 40nm, facilitated by the Power Drive© feature of the ultramicrotomes. This allows for the sectioning of extremely hard materials.

Applications
Ultramicrotomy is used to cross-section hard semiconductor, dielectric, and metal coatings in the electronics and optics industries. It enables the study of structure/property relationships in thin films using Transmission Electron Microscopy and qualitative elemental analysis by EDS.

Sample Preparation
Samples are prepared from micro-chips approximately 1000 microns in diameter, cleaned, and embedded in Spurrs epoxy resin before sectioning.

Examples
- Cubic Boron Nitride on Silicon (Bar = 25nm)
- PS E-beam Deposited TiO2/SiO2 Optical Multilayer (Bar = 25nm)
- E-beam Evaporated Deposition of Fluoride Compound on Glass Substrate (Bar = 200nm)
- ZnS/SiO2 Multilayer Optical Coating (Bar = 50nm)

Contact Information
Boeckeler Instruments, Inc.
4650 South Butterfield Drive, Tucson, AZ 85714, U.S.A.
Phone: (520) 745-0001
Fax: (520) 745-0004
Email: [email protected]
Website: www.rmcboeckeler.com

© 2015 Boeckeler Instruments, Inc. All specifications subject to change without notice.

Catalog excerpts

These images are cross-sectional electron micrographs taken from ultra-thin sections cut with a diamond knife on an RMC ultramicrotome. (see MT-XL and MT-X datasheets) The materials are extremely hard so sections are typically cut at a sectioning speed of 0.1mm/ sec with a section thickness of 40nm. The Power Drive© feature of our ultramicrotomes makes it possible to cut such hard materials. Cubic Boron Nitride on Silicon Bar = 25nm PS E-beam Deposited Ti02/SiO2 Optical Multilayer Bar = 25nm

Open the catalog to page 1

Ultra-thin sectioning with an ultramicrotome is frequently used to cross-section hard semiconductor, dialectric and metal coatings used in the electronics and optics industry. This method provides a critical capability to study the structure/property relationships in thin films using Transmission Electron Microscopy and qualitative elemental analysis by EDS. Samples are typically prepared from micro-chips in the order of 1000 microns in diameter, cleaned and embedded in Spurrs epoxy resin prior to sectioning on the ultramicrotome. E-beam Evaporated Deposition of Fluoride Compound on Glass Substrate...

Open the catalog to page 2