E11_SMD_Pin_Connector - 1 Pages

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E11_SMD_Pin_Connector

Catalog excerpts

Material    typical CuZn alloy Surface    2-3 pm nickel, 5 pm tin, 0,15 pm gold Insulator body Thermopl. polyester glass fiber reinforced, UL 94V0 Operation temper. -55 up to 125 °C Solder temperature from 235°C acc. IEC 68-2-54 Ta Solder heat resist. up to 260°C 10 sec. acc. IEC 68-2-20 Tb Rated voltage 100 VRMS / 150 VDC Insulation resistance    > 1010 Q Air and creepage distance > 1.0 mm Moisture sensibility level (MSL) J-STD-020C Level 1 □□□□□□□□ □□□□□□□

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