X-Array Series

X-Array Series

X-Array Series

Product catalog summary
Applications
  • High resolution carry-on baggage scanning
  • Security screening
  • Cargo and vehicle inspection
  • Non-destructive testing
  • Food inspection
  • Raw material sorting
  • Thickness measurement
  • Foreign particle detection
  • Personnel/body scanning
  • Tire inspection
Key Features
  • 16-channel high resolution, low noise photodiode array
  • High sensitivity with improved pixel-to-pixel response uniformity and minimized crosstalk
  • Robust and reliable due to flip-chip assembly technology
  • Available pixel pitch options: 1.2, 1.6, and 2.5 mm
  • Supports both dual and single energy imaging configurations
Product Overview

The X-Array Series is a family of back-illuminated photodiode arrays designed for various X-ray imaging applications, including baggage, cargo, vehicle, and industrial inspection. The series offers high sensitivity, improved uniformity, and reduced crosstalk, with robust construction due to flip-chip assembly.

The series includes a wide selection of standard parts that can be easily adapted to customer applications, with pixel pitches of 1.2, 1.6, and 2.5 mm, and multiple scintillator options.

General Characteristics
ParameterX-Array 1.2X-Array 1.6X-Array 2.5
Pixel size0.9 x 2.1 mm1.25 x 2.0 mm2.15 x 2.8 mm
Substrate sizeWide: 19.0 x 17.8 mm, Narrow: 19.0 x 10.2 mmWide: 25.4 x 17.5 mm, Narrow: 25.4 x 10.2 mmWide: 40.0 x 17.5 mm, Narrow: 40.0 x 10.2 mm
Junction capacitance35 pF typ.40 pF typ.80 pF typ.
Shunt resistance2 GΩ2 GΩ1 GΩ
Sensitivity @ 550nm370 mA/W typ.370 mA/W typ.370 mA/W typ.
Non-uniformity, pixel-to-pixelmax +/-10%
Scintillator optionsGOS screen, Ceramic GOS, CsI(Tl), CdWO4
Operating and storage temp range-20…+60˚C
Contact Information

Detection Technology
Elektroniikkatie 10
90590 Oulu, Finland
Tel. +358 20 766 9700
Fax +358 20 766 9709
Email: [email protected]
Website: www.deetee.com

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Catalog excerpts

X-Array Series-1

Photodiode Array SeriesAPPLICATIONS • High resolution carry-on baggage scanning • Security screening • Cargo and vehicle inspection • Non-destructive testing • Food inspection • Raw material sorting • Thickness measurement • Foreign particle detection • Personnel/body scanning • Tire inspection The X-Array Series is an enhanced product family of back-illuminated photodiode arrays for numerous X-ray imaging applications like baggage, cargo, vehicle and industrial inspection. The series comes with high sensitivity, improved pixel-to-pixel response uniformity, and reduced or even eliminated crosstalk. Moreover, the back-illuminated photodiode technology with the flip-chip assembly process makes the detectors robust and reliable. The X-Array series includes wide selection of standard parts easily fitted to customer applications. It covers pixel pitches of 1.2, 1.6 and 2.5 mm, and is available with several scintillator options and different pin lengths. X-Array series is designed to support both dual and single energy imaging configurations. KEY FEATURES • 16-channel high resolution, low noise photodiode array • High sensitivity, improved pixel-to-pixel response uniformity, minimized crosstalk • Robust and reliable by flip-chip assembly technology • 1.2, 1.6 and 2.5 mm pixel pitch options available as standard products • Support both dual and single energy imaging configurations

 Open the catalog to page 1
X-Array Series-2

DETECTION TECHNOLOGY Elektroniikkatie 10 90590 Oulu Finland All images © Detection Technology DS0000120A

 Open the catalog to page 2

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