video corpo

D013

D013

D013

Product catalog summary
General Features
The D013 is a compact MVB Interface chip measuring 48 x 50 mm, designed for multipurpose communication. It includes features of the MVB architecture such as Process and Message Data, Bus Administrator, and supports both EMD and ESD+ physical layers. The MVB controller is implemented in an FPGA, supporting 4096 process data ports, and a 32-bit softcore manages the message data stack. The D013 is available in two configurations: MDFULL (passive) and SERVER (active with MD RTP stack), reducing CPU requirements on the host system. It complies with TCN standard IEC 61375 up to class 4 and is suitable for harsh environments, conforming to EN 50121, EN 50155, and EN 61373 standards.
Key Benefits
The D013 features integrated MVB line transceivers with galvanic insulation, configurable operation modes (8-bit parallel or serial UART), and multiple mounting options (soldered, plugged, or press-fit). It is compatible with EMD and ESD+ layers and offers optional MVB Bus Administrator functionality. The module is designed for harsh traction environments and complies with relevant standards.
Application Examples
The D013 serves as a generic MVB interface supporting various MVB classes and physical layers.
D205 / D206 Evaluation Kit
This kit facilitates host software development using serial (D205) or parallel (D206) interfaces. It includes an adapter card for mounting the D013, reference schematics, and software examples to expedite integration.
Technical Data
  • CPU Base System: 32-bit soft CPU, 128 MB RAM, Flash file system.
  • MVB Interface: Supports two redundant MVB lines with galvanic insulation, configurable for passive or active interface.
  • MVB Software: Available in MDFULL or SERVER configurations, supports 8-bit parallel host interface UART, and includes duagon UART emulation.
  • Diagnostic/Service: Device status and firmware updates via Ethernet, JTAG, and serial line available.
  • Supply Voltage: Single 3.3 V power supply.
  • Power Consumption: Typically 1.3 W.
  • Operating Conditions: -40 to +85°C, 75% humidity, shock and vibration compliant with IEC 61373, EMI compliant with EN 50121 and EN 50155.
  • Dimensions/Weight: 48 x 50 x 13 mm, approx. 20g.
  • Environment: RoHS and REACH compliant.
Product Ordering Table
Various configurations and options are available, including different MVB functions, Bus Administrator presence, connector options, insensitivity settings, and host interface compatibility. Detailed ordering information and related documents are available on the duagon website.
See more

Catalog excerpts

D013-1

General Features The D013 is a multipurpose MVB Interface on a small 48 x 50 mm size footprint. It is a fully featured MVB communication chip including all features of the MVB architecture such as Process and Message Data, Bus Administrator, and both EMD or ESD+. duagon's own MVB controller is implemented in an FPGA and supports all 4096 process data ports. An additional 32-bit softcore handles the complete message data stack with an easy-to-use interface. - MDFULL: passive MVB interface with duagon's MVB controller - SERVER: active MVB interface including the Message Data Real Time Protocol stack (MD RTP). This approach minimizes the CPU requirements of the host system, because the major part of the communication software is running on the duagon interface The optionally includable Bus Administrator manages the complete MVB Network and can be configured using the duagon's proprietary network tool. The D013 fully complies with the TCN standard IEC 61375 up to class 4. It is designed for the harsh traction environment and conforms to the EN 50121, EN 50155 and EN 61373 standards, e.g. by: - Coating against humidity - Enhanced EMI and vibration robustness - Integrated MVB line transceivers (including galvanic insulation) - Configurable to operate in 8-bit parallel or serial (UART) mode - The D013 can be either soldered, plugged or pressed into the motherboard (press fit option) - The module is compatible with EMD and ESD+ physical MVB layers - MVB Bus administrator functionality available as option - The D013 conforms with the EN50121, EN50155, EN 61373 and IEC61375 standards, and is designed for the harsh traction environment - Generic MVB interface featuring different MVB classes and physical MVB layers D205 / D206 Evaluation Kit This evaluation kit allows the development of the host software A reference schematic and software examples help to speed up using either the serial (D205) or the parallel (D206) interface. the integration time. The delivered adapter card enables the mounting of any D013.

 Open the catalog to page 1
D013-2

 32-bit soft CPU  128 MB RAM  Flash file system  Supports two redundant MVB lines A and B  MVB lines A and B are galvanically insulated from the logic/IO and from each other  MVB physical layers ESD+ or EMD  The software structure depends on the chosen configuration passive or active interface Diagnostic / Service  Device status information/identification available through host interface  Firmware update via Ethernet  JTAG and serial line available Technical Data Supply Voltage  Single power supply  3.3 V Power Consumption Operating Conditions  Ambient temperature: –40 to +85°C (EN...

 Open the catalog to page 2

All Duagon Germany GmbH catalogs and technical brochures

  1. D015M

    2  Pages

  2. PX1N

    4  Pages

  3. D217

    2  Pages

  4. D215

    2  Pages

  5. D153E

    5  Pages

  6. D135EML

    2  Pages

  7. D134E

    2  Pages

  8. D114RS

    2  Pages

  9. D114L

    2  Pages

  10. D113

    2  Pages

  11. D023E

    4  Pages

  12. D017M

    2  Pages

  13. D015M

    2  Pages

  14. D015E

    2  Pages

  15. i012

    26  Pages

  16. i214

    27  Pages

  17. i303

    21  Pages

  18. BL72E

    6  Pages

  19. D501

    5  Pages

  20. G240

    5  Pages

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.