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ULTRA® 3SP? and 3SP? HD

ULTRA® 3SP? and 3SP? HD

Product catalog summary
Overview: EnvisionTEC's ULTRA® 3SP™ Series 3D printers utilize innovative 3SP™ technology to produce highly accurate 3D printed parts from STL files, regardless of complexity. The ULTRA® 3SP™ and 3SP™ High Definition models come with software for automatic support generation and model production, ensuring high surface quality without stairstepping.
Machine Properties:
  • Build Envelope: 10.5" x 6.9" x 7.6" (266 x 175 x 193 mm) for both models.
  • Resolution: ULTRA® 3SP has 0.004" (100 µm) in X and Y; High Definition has 0.002" (50 µm).
  • Dynamic Voxel Resolution in Z: Adjustable from 0.001" to 0.004" (25 - 100 µm).
  • Data Handling: STL format.
  • Warranty: 1 year included.
Materials Available:
  • ABS 3SP™ Flex: Available in Black, Gray, and White, offering flexibility similar to ABS plastic.
  • ABS 3SP™ Tough: Provides rigid, stable models.
  • ABS 3SP™ Superflex: Offers flexibility similar to ABS plastic.
  • E-Denstone 3SP™: Suitable for high-temperature molding and concept models.
  • E-Glass 3SP™: Strong, clear material with flexible capabilities.
System Properties:
  • Single material used for both build and support.
  • Supports are easily removable and partially cured.
  • Few moving parts for user-serviceability.
  • Office-friendly with plug-and-play operation and built-in touchscreen.
  • Utilizes 3SP™ technology for reliability.
  • Low part cost due to minimal material waste.
  • Capable of producing concept models to functional parts.
  • Layerless technology ensures no stair stepping.
  • Quiet operation.
Physical and Electrical Specifications:
  • Footprint: 29" x 30" x 46" (74 x 76 x 117 cm).
  • Optional Stand: 29" x 30" x 25" (74 x 76 x 64 cm).
  • Weight: 198 lbs (89.8 kg).
  • Electrical Requirements: 100-127 VAC, 50/60 Hz, single phase, 8A or 200-240 VAC, 50 Hz, single phase, 4A.
Contact Information: EnvisionTEC GmbH in Germany and EnvisionTEC, Inc. in the USA. Visit www.envisiontec.com for more information.
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Catalog excerpts

ULTRA® 3SP? and 3SP? HD-1

ULTRA® 3SP™ and 3SP™ High Definition EnvisionTEC’s ULTRA® 3SP™ Series 3D printers use ground-breaking 3SP™ (Scan, Spin and Selectively Photocure) technology to quickly 3D print highly accurate parts from STL files regardless of the geometric complexity. The ULTRA® 3SP™ and 3SP™ High Definition are each delivered and installed with all the relevant software to enable automatic generation of supports and perfect model production. The surface quality of the printed models show no signs of stairstepping on the inner and outer surfaces. The reliability of the imaging light source and the high speed productivity makes it the most competitive 3D printer on the market today. Machine Properties * ULTRA® 3SP High Definition Build Envelope Dynamic Voxel Resolution 0.001" - 0.004" in Z (User Adjustable and (25 - 100 µm) Material Dependent)** Data Handling * Specifications are subject to change without notice. ** A voxel is a volumetric pixel. Materials Available Ideal for ABS 3SP™ Flex Black Models similar to ABS plastic with flexibility characteristics Models similar to ABS plastic with flexibility characteristics ABS 3SP™ Flex White Models similar to ABS plastic with flexibility characteristics ABS 3SP™ Tough Rigid, stable models similar to those made with ABS plastic Models similar to ABS plastic with flexibility characteristics General purpose, high temperature molding, concept models Strong, clear material with flexible capabilities System Properties EnvisionTEC GmbH Brüsseler Straße 51 •  D-45968 Gladbeck •  Germany Phone  +49 2043 9875-0 Fax  +49 2043 9875-99 EnvisionTEC, Inc. 15162 S. Commerce Dr Dearborn, MI 48120 • USA Phone +1-313-436-4300 Fax +1-313-436-4303 www.envisiontec.com [email protected] »» A single material is used for both build and support »» Easily removable, partially cured perforated supports »» Very few moving parts make the system user-serviceable »» Office friendly plug-and-play operation with a built-in touch screen »» Extremely reliable system utilizing 3SP™ (Scan, Spin, and Selectively Photocure) technology »» Low part cost due to minimal material waste »» Produce everything from concept models to functional parts »» Layerless technology with no stair stepping on inner and outer surfaces »» Quiet operation Footprint (L x W x H): 29" x 30" x 46" (74 x 76 x 117 cm) Optional Stand (L x W x H): 29" x 30" x 25" (74 x 76 x 64 cm) Weight: 198 lbs (89.8 kg) Electrical Requirements: 100-127 VAC, 50/60 Hz, single phase, 8A 200-240 VAC, 50 Hz, single phase, 4A Patents Pending

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.