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X-ray TDI camera C12300-321

X-ray TDI camera  C12300-321

X-ray TDI camera C12300-321

Product catalog summary
Overview: The C12300-321 X-ray TDI camera is designed for high-speed, high-resolution in-line applications. It features bidirectional scanning, high sensitivity, and a large field of view, making it suitable for various inspection tasks such as PCB, surface-mounted components, and battery inspections.
Specifications: The camera operates with a single +15 V power supply and consumes approximately 45 VA. It supports a Camera Link interface with a base configuration and outputs 12-bit digital signals. The effective X-ray tube voltage range is approximately 25 kV to 130 kV, with a CCD pixel size of 48 μm × 48 μm and a detection area of 4608 (H) × 150 (V) pixels.
Key Features: The camera offers high-speed readout up to 20 kHz and supports bidirectional scanning to improve machine cycle time. It includes real-time dark current and shading correction functions, enhancing image quality. The TDI technology allows for continuous video imaging of moving objects, providing higher resolution at lower light levels.
Applications: The camera is ideal for high-resolution, non-destructive in-line inspections. It can inspect long-length objects without distortion, making it suitable for tasks like solder back fillet inspection and void inspection in BGAs. The TDI technology ensures accurate dimensional measurements without the need for sample relocation.
Performance: The camera achieves a line speed of up to 86.4 m/min with a maximum TDI line rate of 15.0 kHz. It supports high-speed scanning with a narrow irradiation area, reducing X-ray exposure and system size.
Design Considerations: The camera has a dead space between chips, which is minimized to ensure seamless imaging. It is compact, weighing approximately 4.4 kg, and is compatible with various power supply units and software APIs for integration into existing systems.
Conclusion: The C12300-321 X-ray TDI camera is a versatile and efficient solution for high-speed, high-resolution imaging applications, offering significant improvements in inspection accuracy and operational efficiency.
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Catalog excerpts

X-ray TDI camera  C12300-321-1

X-ray TDI camera C12300-321 High speed readout Large field of view High resolution High sensitivity Evolutional high speed scanning with TDI technology Bidirectional scanning operation is supported High speed readout Detection area Horizontal spatial resolution X-ray TDI camera is useful for in-line applications requiring high-speed operation, high sensitivity and high resolution with wide area. C12300-321 is drastically improved the line speed up to 86.4 m/min. With bidirectional scanning operation, it enables to capture the objects effectively and improves the machine cycle time. TDI technology Time Delay Integration is a technology of scanning in which a frame transfer device produces a continuous video image of a moving object by means of a stack of linear arrays aligned with and synchronized to the motion of the object to be imaged in such a way that, as the image moves from one line to the next, the integrated charge moves along with it, providing higher resolution at lower light levels than is possible with a line-scan camera. Object motion Conveyor belt Signal intensity High speed readout (20 kHz) Bidirectional scanning operation Improving radiation hardness High S/N ratio with 12 bit output Camera Link interface (Base configuration) Single power supply (+15 V) operation Real time dark current / shading correction function Frame readout mode for easy installation alignment Shield box X-ray light source Printed circuit board (PCB) inspection Surface-mounted component inspection Battery inspection High-resolution in-line non-destructive inspection

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X-ray TDI camera  C12300-321-2

High resolution, High speed camera with a Large field of view for In-line 100 % X-ray inspection

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X-ray TDI camera  C12300-321-3

MEASUREMENT EXAMPLES Inspection of a solder's back fillet Soldering failure Normal soldering Line scan Line scan Profile If the back fillet of the solder on a PCB has a defect, a connection error will occur even with small vibrations. For observation of the back fillet part, X-ray transmission technique has been applied but only with an off-line system. Our X-ray TDI camera realizes in-line inspection because it can acquire high speed profile data with high sensitivity. 3D brightness level can be displayed using software. Defect point Lithium-ion battery inspection In case of 2D sensor, the dimensional...

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X-ray TDI camera  C12300-321-4

MEASUREMENT EXAMPLES Void inspection of BGAs (Ball Grid Array) X-ray TDI camera Line sensor reduced X-ray irradiation area X-ray TDI camera can inspect the samples easily by high speed scan with narrow irradiate area. S/N ratio is one of advantage and low X-ray radiation is enough to inspect the void existence. Furthermore it contribute to make a smaller size of system by reducing a lot of X-ray irradiation. DIMENSIONAL OUTLINES X-ray TDI camera can reduce the X-ray irradiation on the sample dramatically by high speed with narrow irradiation area. So it can reduce the risks to break down the...

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