From Eye to Insight eica ION BEAM MILLING SYSTEM FOR TEM, SEM AND LM PREPARATION Leica EM RES102

In recent years, ion milling has been developed into the most For TEM sample preparation a low ion incidence with respect applicable method of sample preparation for the analysis of to the sample surface polishes the sample until it is electron inorganic material. The ion beam milling method uses high energy ion bombardment to remove material or modify the surface of a sample. The ions are generated by an ion gun Surface modification for SEM samples, for example, can be (in a high vacuum) toward the sample, which is orientated so realized with higher milling angles up to 90°. This includes the...

LEICA EM RES102 – ION BEAM MILLING SYSTEM Unique Solution The Leica EM RES102 is a unique ion beam milling device that has two saddlefield ion sources with variable ion energy for optimum milling results. Like no other instrument on the market, it accommodates the preparation of TEM, SEM and LM samples in one single benchtop unit. In addition to high-energy milling, the Leica EM RES102 can be used for very gentle sample processing using low ion energy. ›› Single-sided or double-sided low angle milling for uniform ion ›› Ion beam polishing of surfaces up to 25 mm in diameter with milling of materials....

TEM, SEM or LM preparation – a matter of choice To support the diverse range of application possibilities, the Leica EM RES102 can be equipped with a variety of sample holders for the preparation of TEM, SEM and LM samples. The load-lock system provides high sample throughput with fast sample exchange. Sample holder for the cleaning, polishing and contrast enhancement of SEM and LM samples at environment temperature or with LN2 cooling. The SEM holder allows you to prepare a sample size up to 25 mm diameter. An adapter is available to clamp commercially available SEM stubs with a 3.1 mm diameter...

LEICA EM RES102 – ION BEAM MILLING SYSTEM SEM clamp holder to hold small samples SEM with maximal dimensions of 5(H) x 7(W) x 2(T)mm. This holderhold smalleasily transferClamp holder to can be samples with maximum dimensions red toof 5 (H) × 7 (W) × 2 (D) mm. This holder is easily transferred the SEM without removing the sample. directly to the SEM without removing the sample. Sample holder (Quick clamp holder) for single and double-sided low angle milling down to 4°. TEM Sample Holder (Quick Clamp Holder) for single and double-sided low angle milling down to 4°. Cooling holder for the preparation...

Your Benefits Leica EM RES102 can thin, clean, cross section, polish and provides contrast enhancement with the highest level of flexibility for the user. EASY OPERATION EFFECTIVE AND COST EFFICIENT ›› C control unit with 19” touch screen P ›› Precise automatic termination feature for process monitoring and controlling with optical image processing or Faraday cup for light transparent ›› Integrated applications library ›› Improved effectiveness in TEM sample preparation by large electron ›› Programmable process parameters transparent area of TEM samples accelerate the learning curve of beginners...

LEICA EM RES102 – ION BEAM MILLING SYSTEM Gold wire bonds after ion beam polishing Oil Shale at the rim of 25 mm diameter after ion beam polishing STEM images of a Ti film that has been ion beam milled at an angle of 6° Solder ball after ion beam polishing HRTEM image of SiTiO3 after FIB cleaning

Two saddle-field gun with large area milling properties 0.8 keV to 10 keV Up to 4.5 mA (per ion source) ~ 1 mA/cm2 at 8 kV/3 mA (per ion source) 0.8 mm (at 10 keV), 2.5 mm (at 2 keV) Argon (Ar 5.0) Incoming pressure 500 mbar < 1 sccm/ion source with automatic control Rotation Oscillation Zero point set up In x direction Tilting Specifications ION SOURCE Ion gun Ion energy Source current Ion current density FWHM Gas used MOTORIZED ANGLE SETTINGS (PC CONTROLLED)_ Gun tilting - Gun 1 ± 45° (0.1° setting accuracy) Sample holder tilting -120° to 210° (0.1° setting accuracy) Milling angle range -90°...

LEICA EM RES102 – ION BEAM MILLING SYSTEM – ION BEAM MILLING SYSTEM LEICA EM RES102 COOLING DEVICE (OPTIONAL AVAILABLE) › Automated liquid nitrogen cooled contact mechanism › Automated heat up control to avoid moisture contamination of the sample › LN2 consumption ~ 0.6 l/1 h CONTROL (USER INTERFACE) › PC control unit with 19" touch screen › LAN capability for external operation and monitoring › Integrated application library (programs) › Individual programming and storage of milling parameters in steps or sequences VACUUM SYSTEM › Oil-free < 1 × 10 –5 mbar, four stage system diaphragm and turbo...

Synergies with the Leica EM TXP Prior to using the Leica EM RES102, mechanical preparation is often required to get as close as possible to the area of interest. The Leica EM TXP is a unique target surfacing system developed for cutting and polishing samples prior to follow-on techniques with instruments such as the Leica EM RES102. The Leica EM TXP is specially designed to prepare samples by sawing, milling, grinding and polishing. It excels with challenging specimens where pinpointing and preparing difficult targets becomes easy. The Leica EM TXP is a unique target surfacing system developed...

LEICA EM RES102 – ION BEAM MILLING SYSTEM 3 mm disc of a cross-sectioned IC-package with a thickness of 40 µm, mechanically prepared with the Leica EM TXP, clamped in the TEM sample holder of the EM RES102.

qualityaustria SYSTEM CERTIFIED ISO 9001:2008 No.00805/0IS014001:2004 No.02783/0 Leica Mikrosysteme GmbH | Vienna, Austria T +43 1 486 8050-0 | F +43 1 486 8050-30 www.leica-microsystems.com Leica EM RES102 Brochure •English • 02/2016 • Order no. 167220002 ■ Copyright © by Leica Mikrosysteme GmbH, Vienna, Austria, 2015. Subject to modifications. LEICA and the Leica Logo are registered trademarks of Leica Microsystems IR GmbH.