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Potting of Elecronic Components

Potting of Elecronic Components

Potting of Elecronic Components

Product catalog summary
Technical Specification Summary for Burhani Resin EP-60F and Hardener EH-408
General Information:
EP-60F is a DGEBA type epoxy resin designed for void-free encapsulation and casting. EH-408 is a polyamide hardener used for adhesives, castings, encapsulation, and potting of electronic components.
Properties of Resin EP-60F:
  • Appearance: Opaque, viscous liquid (Green/Black)
  • Viscosity at 30°C: 30-40 sec
  • Ash Content: 49-51%
  • Specific Gravity at 25°C: 1.50-1.60
  • Flash Point: >100°C
  • Storage Stability: 12 months
Properties of Hardener EH-408:
  • Type: Polyamide
  • Appearance: Amber colored viscous liquid
  • Viscosity at 25°C: 200-600 cps
  • Amine Value: 348-404 eq/kg
  • Specific Gravity at 25°C: 0.94-0.96
  • Storage Stability: 12 months
Mix Ratio and Pot Life:
  • Mix Ratio (EP-60F:EH-408): 100:25
  • Initial Mix Viscosity at 30°C: 1600 cps
  • Pot Life at Room Temperature: 120-160 minutes
  • Curing in Thick Layer: Tack free & hard mass
Curing Schedule:
  • Curing Temperature and Time: 20°C for 48 hrs, 30°C for 24 hrs, 40°C for 16-20 hrs
  • Post Curing: 4-6 hrs at 80°C if necessary
Typical Properties of Cured Compound:
  • Flexural Strength: 36.5 MPa
  • Izod Impact Strength: 10.36 Kj/m²
  • Compressive Strength: 69 MPa
  • Tensile Strength: 27.5 MPa
  • Hardness: Shore D 79
  • Heat Distortion Temperature: Under study
  • Coefficient of Linear Thermal Expansion: 4.20 x 10¯5 /°C
  • Thermal Conductivity: 0.401 W/mk
  • Dielectric Strength: 14.2 kV/mm
  • Volume Resistivity: 1.3 x 10¹ Ohms-cm
  • Dielectric Constant: 2.92
  • Dissipation Factor: 0.0290099
  • Comparative Tracking Index: >600 V
Chemical Resistance:
  • 25% H2SO4 at RT (24 hours): Weight change +0.55%, no discoloration, delamination, or deformation
  • 5% NaOH at RT (24 hours): Weight change +0.24%, no discoloration, delamination, or deformation
Safety Precautions:
Avoid direct contact with skin. Use gloves during handling. Remove splashes immediately with a suitable remover.
Note:
The information reflects current experience and usage. No warranty or responsibility for specific technical results is assumed.
For further technical information, contact:
110 General Patters Road, Chennai – 600002, India.
+919677296252, [email protected]
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Catalog excerpts

Potting of Elecronic Components-1

TECHNICAL SPECIFICATION Burhani Resin EP- 60F and Hardener EH – 408 General Information:EP – 60F is a DGEBA type of Epoxy resin, suitably formulated and processed to obtain void free encapsulation and castings. Hardener EH –408 is a Polyamide hardener. Generally, it is used for adhesive, castings, encapsulation & potting of electronic components. Properties of the resin EP - 60F: Property. Appearance. Method. Visual Specific gravity at 25° C. Flash Point Storage stability. Specification. Opaque, viscous liquid. ( Green/Black) °C when stored in original Containers atR.T Properties of the hardener EH – 408:Property. Type of compound. Appearance. Viscosity at 25° C By Brookfield. Amine Value Specific gravity at 25° C. Storage stability. Method. ----Visual RPC/STP/007. Dt.10/05/2018. RPC/STP/002. Dt.10/05/2018. RPC/STP/009. Dt.10/05/2018. when stored in original Containers atR.T Specification. Polyamide. Amber coloured viscous liquid. 110 General Patters Road. Chennai – 600002. India. +919677296252, bhftec

 Open the catalog to page 1
Potting of Elecronic Components-2

Mix ratio and Pot life: Property. Initial Mix Viscosity @ around 30°C. EP – 60F : EH – 408 100:25 Pot life at R.T Observed Value. Curing in thick layer. Tack free & Hard mass. Curing Schedule: Curing Temperature °C Curing Time Post Curing: 4 - 6 Hrs at 80°C if necessary. Typical properties of cured compound: Specimen Cured at 16 hours at RT and 4 hours at 80°C. S.No 1. 2. Property Flexural Strength Izod impact strength (un notched) Compressive strength Tensile strength Test speed: 5mm/min Hardness Heat Distortion Temperature.(Martens) Co-efficient of linear thermal expansion (CLTE) 30 - 60°C...

 Open the catalog to page 2
Potting of Elecronic Components-3

Chemical 25% H2 SO4 @RT (24hours) Weight change Dimensional change Visual appearance 5% NaOH @RT (24hours) Weight change Dimensional change Visual appearance Observed value. + 0.55 Nil No discoloration , no delamination and deformation is observed. + 0.24 Nil No discoloration , no delamination and deformation is observed. SAFETY PRECAUTIONS: Avoid direct contact of resin/ hardener with skin. Use of hand gloves during handling is recommended. Splashes on the skin, if any should be removed immediately with suitable remover. Note:- The information given here reflects our present experience in development...

 Open the catalog to page 3

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