
ASYMTEK Helios SD-960 Series The Helios® SD-960 Series offers dependable ruggedization, reliability, structural performance, and thermal management for automotive, 5G infrastructure, industrial, defense and aerospace applications. You might know us best for our advanced micro-dispensing solutions and in-depth application expertise. We’ve been there from the beginning — with breakthrough dispensing platforms, jetting, and process controls. Now our unmatched dispensing technologies are available in a large-volume format. Brimming with functional features, the Helios SD-960 Series delivers the advanced performance you’ve come to expect. What’s more, our solutions include everything you need to initiate your process. Dispense large-volumes of one- (1K) or two-component (2K) structural, thermal, bonding, sealing or potting materials with our all-in-one solutions. Your local representative has all the details. Contact us today.
Open the catalog to page 12|| lASYMTEK Helios SD-960 Series Featured options: Rotate and tilt dispensing allows the dispense tip to access four sides of a part, or other areas not accessible with a standard vertical configuration Mass Flow Calibration -simplifies setup and ensures the right amount of material is dispensed to each part for an entire production run " Custom, Automated Optical Inspection (AOI) hardware and software • Advanced closed-loop process controls ensure consistent, repeatable results • Ratio validation delivers precise mix ratios and fluid characteristics - enabled through servo-controlled volumetric...
Open the catalog to page 2ASYMTEK Helios SD-960 Series | 3 The Helios SD-960 Series offers large- and medium-volume, 1K and 2K dispensing solutions complete with pumps, valves, metering systems, process controls and a range of customizable options. The Helios supports line width, dot diameter and volume deposit ranges as shown in the table. If your application requires smaller, micro-dispense capabilities, ask your local representative for alternative dispensing system options. Dispense Volume
Open the catalog to page 34 | ASYMTEK Helios SD-960 Series Thermal Paste Structural Adhesives Dispensable thermal materials offer a cost effective, flexible and efficient alternative to thermal pads for high-volume applications. Thermal materials are reliable, easy to apply, and fill gaps of any size -vertical or horizontal. When you consider the effort that goes into designing, ordering, stocking, and applying thermal pads, it’s easy to see the thermal material advantages. When a PCB is exposed to shock or vibration, the electrical connections of larger or heavier components experience stress that can lead to failure....
Open the catalog to page 4ASYMTEK Helios SD-960 Series | 5 The Helios SD-960 Series is an automated dispense platform that deposits medium- and large-volumes of material. The platform is ideal for 1K and 2K applications — thermal paste, structural adhesives, sealing, gasketing, and potting — that require enhanced throughput and advanced process control. Fluidmove system software provides unparalleled process control and programming capabilities. The system camera and height sensor support post-dispensing commands to check dispense results, without the need for additional hardware. If more detailed inspection is necessary,...
Open the catalog to page 56 | ASYMTEK Helios SD-960 Series It’s not an exaggeration to say that cars are becoming IoT devices. Today’s drivers rely on service notifications, backup cameras and parking sensors. Some systems provide collision avoidance, adaptive cruise control and emergency breaking. With sensors in nearly every area — engine control units (ECUs), lighting electronics, Important areas of focus include: • Protecting electronics from harmful influences such as moisture, extreme temperatures or corrosive substances that affect performance • Ensuring reliability powertrain, driver assistance, infotainment,...
Open the catalog to page 6ASYMTEK Helios SD-960 Series | 7 ASYMTEK Helios SD-960 Series | 7 Automotive Applications Design a 1K or 2K Helios solution to address: • Thermal paste dispensing - An efficient alternative to thermal pads, 1K and 2K pastes can be dispensed to accommodate every gap dimension - vertical or horizontal with a high level of control • Adhesive bonding - For covers and housings, automotive body, vehicle interior elements and more • Sealing - For bonding and protecting housings, ECUs, enclosures, transmissions, gearboxes, sensors and more • Potting - For the encapsulation of batteries, chips and sensors,...
Open the catalog to page 78 | lASYMTEK Helios SD-960 Series Carriers and telecommunications companies across the globe are working quickly to build new base stations and antenna arrays to support 5G services. Macro, micro, and picocell base stations are needed to cover wide, densely populated, and localized areas. Massive MIMO (multiple input, multiple output) antennas with large numbers of antenna elements are also needed to send and receive more data simultaneously. And that’s just the beginning. As 5G technology matures, businesses and consumers alike will benefit. Manufacturing’s Industry 4.0, smart cities, smart...
Open the catalog to page 8ASYMTEK Helios SD-960 Series | 9 ASYMTEK Helios SD-960 Series | 9 5G and loT Applications Design a 1K or 2K Helios solution to address: • Thermal paste dispensing - An efficient alternative to thermal pads, 1K and 2K pastes can be dispensed to accommodate every gap dimension - vertical or horizontal with a high level of control • Adhesive bonding - For case and package assembly • Sealing - For case and package assembly, form-in-place gaskets, electro-mechanical assemblies, and protection from harmful elements • Potting - To protect intellectual property and for the encapsulation of batteries,...
Open the catalog to page 910 | ASYMTEK Helios SD-960 Series Important areas of focus include: Providing ruggedization Ensuring reliability Protecting electronics from harmful influences such as moisture, extreme temperatures or corrosive substances that affect performance Addressing thermodynamic challenges / Aerospace and defense electronics must be broadly suited for harsh environments. In these areas, electronic components are exposed to land, sea, atmosphere and space. Components must be ruggedized to withstand high shock and vibration and extreme temperatures, altitudes, and relative humidity. Dispensing applications...
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