MARCH FlexTRAK and FlexTRAK-S Plasma Processing of Strip-Type Components for Semiconductor Packaging Applications • Industry-leading throughput capacity with unmatched cycle times. • A slim structure that requires minimal floor space, and all service components are easily accessible from the front. • Closed-loop plasma control for RF system optimization and minimized tuning time. • Automatic recycle to a plasma-ready state compensates for varied lot sizes, vacuum pressure, and temperature change. • Achieve maximum power to the chamber in seconds with a proprietary algorithm that constantly measures forward and reflective power inside the chamber. • The systems support variable-size form factors, including boats, carriers, Jedec/Auer® boats, strips, and laminates. • Flexible chamber configurations support direct, downstream, and ion-free plasma treatment modes, allowing treatment without exposure to ions and UV. • Magazine-to-magazine processing of single and multiple strips or lead-frames and standalone configurations for island-based production environments. • Easy integration with existing process equipment, including wire bond, die-attach, dispense, mold, and marking

FlexTRAK and FlexTRAK-S FlexTRAK The three-axis symmetrical chamber in the FlexTRAK plasma system treats all positions of a product uniformly while maintaining tight control over process parameters for repeatable results. FlexTRAK-S Process larger substrates with high uniformity, quality, and short cycle times with the FlexTRAK-S. The system features a 9.6-liter plasma chamber with twice the capacity of a standard FlexTRAK plasma system. Adjustable chamber kits and fixtures support the processing of various substrates and products. The system also includes a high-power RF generator and enhanced...