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MARCH StratoSPHERE

MARCH StratoSPHERE

MARCH StratoSPHERE

Product catalog summary
Overview
The StratoSPHERE™ is a high-throughput plasma treatment system designed for processing semiconductor wafers up to 300 mm (12 in.). It features a patented plasma chamber that ensures exceptional etch uniformity, process repeatability, and efficient cycle-time performance, minimizing the cost of ownership. The system's three-axis symmetrical chamber design guarantees uniform treatment across all wafer areas, with tight control over process parameters for highly repeatable results.
Wafer Cleaning and Etching
  • Removes various contaminants including organic, fluorine, halogen, metal, and metal oxides.
  • Enhances adhesion of spun-on films and metallic bond pads.
  • Performs descumming, dielectric layer patterning, photoresist stripping, and mold/epoxy removal.
  • Destresses wafers to reduce breakage and improves adhesion of gold solder bumps.
Key Applications and Benefits
  • Software-controlled change-over for seamless transition between 200 mm and 300 mm wafers.
  • Production-ready wafer handling supports wafer backside.
  • Modular design allows for single or dual-chamber configurations.
  • Load ports accommodate 200 mm open cassettes or 300 mm FOUP.
  • Unique end effector design for various wafer thicknesses and weights.
  • Chamber kits optimize plasma distribution for maximum uniformity and throughput.
Specifications
  • Dimensions: 1405W x 2615D x 1742H mm (55W x 103D x 69H in).
  • Net Weight: Process Module 480 kg (1058 lbs), EFEM 640 kg (1411 lbs).
  • Chamber Volume: 5.5 liters (338 in³).
  • Chuck Configurations: 200 mm and 300 mm substrate sizes.
  • RF Power: 600 W at 13.56 MHz.
  • Gas Control: Flow volumes of 50, 100, or 250 sccm with up to 3 MFCs.
  • Control Interface: EPC with PC-based touchscreen, SMEMA, SECS/GEM.
  • Vacuum Pump: Standard and optional purged dry pump at 16 cfm.
  • Compliance: SEMI S2/S8, CE Marked.
System Packages
  • Essential: Offers uniformity and repeatability with >95% wafer-to-wafer and >90% within-wafer uniformity.
  • Productivity: Enhances throughput and yield with plasma confinement technology for uniform coverage.
Contact Information
For more information, visit Nordson Electronics Solutions' website or contact them at [email protected]. They have global locations in North America, Asia Pacific, and EMEA.
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Catalog excerpts

MARCH StratoSPHERE-1

MARCH StratoSPHERE Superior Plasma Treatment for High-Throughput Wafer and Panel-Level Packaging The StratoSPHERE™ is a high-throughput plasma treatment system for processing up to 300 mm (12 in.) semiconductor wafers. The patented plasma chamber design provides exceptional etch uniformity, process repeatability, cycle-time performance, and minimal cost of ownership. Its three-axis symmetrical chamber ensures uniform treatment of all wafer areas, and tight control over process parameters ensures highly repeatable results. • Remove contamination before wafer bumping. • Remove organic contamination. • Remove fluorine and other halogen contamination. • Remove metal and metal oxides. • Improve spun-on film adhesion. • Clean metallic bond pads. • Descum wafer of residual photoresist/BCB. • Pattern dielectric layers for redistribution. • Strip/etch photoresist. • Enhance adhesion of wafer-applied materials. • Remove excess wafer-applied mold/epoxy. • Enhance adhesion of gold solder bumps. • Destress wafer to reduce breakage. • Improve spun-on film adhesion. • Clean Aluminum bond pads. • Software-controlled change-over minimizes the transition from 200 mm to 300 mm wafers. • Production-ready wafer handling supports the backside of the wafer. • Modular design allows single or dual-chamber system configuration. • Load ports support 200 mm open cassettes or 300 mm FOUP. • Unique end effector design can transfer a variety of wafer thicknesses and weights. • Chamber kits isolate plasma distribution directly above the wafer, maximizing uniformity and throughput.

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MARCH StratoSPHERE-3

Nordson Electronics Solutions builds the future of electronics reliability all across the globe. We’re proud of the decades of service and solutions we’ve provided to enhance semiconductor reliability. No matter where you are, you’ve likely manufactured or purchased a product made reliable with our equipment. The StratoSPHERE offers industry-leading throughput and reliability for semiconductor manufacturing applications, designed to last and provide cutting-edge capabilities continuing a time-honored tradition. Explore the StratoSPHERE system packages. Continue to see how we support the future....

 Open the catalog to page 3

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