Specifications:
The MEDM-B603 is a COM Express Type 6 module featuring the AMD Ryzen Embedded V1000 Series SoC processor, known for its high performance and advanced 3D graphics capabilities. It supports dual-channel DDR4 ECC SO-DIMM sockets with a capacity of up to 32GB. The module includes a variety of interfaces such as 2x SATAIII, I2C control, and Intel i211AT Ethernet. It operates on a +12V and +5VSB DC power input and is CE and FCC Class B certified.

Display and Graphics:
The module supports multiple display interfaces including 1x LVDS with a resolution up to 1920x1200 @60Hz, and 2x DP++ (DP/HDMI/DVI) with varying resolutions up to 4096x2160 @60Hz for HDMI. It is equipped with an AMD Radeon™ GFX9 graphic controller with up to 11 compute units.

Expansion and I/O Interfaces:
Expansion options include 1x PEG x4, 1x PCIe x4, and 2x PCIe x1. The I/O interfaces consist of 2x USB 2.0 and 4x USB 3.1 Gen 1 ports. The module also features a high-definition audio interface.

Environmental and Mechanical:
The MEDM-B603 has dimensions of 125 mm x 95 mm and operates within a temperature range of 0°C to 60°C with passive cooling. It is designed to withstand storage temperatures from -40°C to 85°C and operates in humidity levels of 5% to 95% non-condensing. The module is RoHS compliant and has an MTBF of over 120,000 hours at 40°C.

Features:
Key features include support for triple displays, next-generation AMD Secure Processor, and a variety of connectivity options. The module is available in different configurations, including the MEDM-B603-1605B with AMD Ryzen V1605B and the MEDM-B603-1807B with AMD Ryzen V1807B.

Ordering Guide:
The ordering guide lists the available configurations and compatible coolers, such as the ABC-3016 for the MEDM-B603-1605B.