Forge1
Forge1
- Model: Forge1
- Build Volume: 300 × 300 × 300 mm (Single Extruder), 255 × 300 × 300 mm (Dual Extruder)
- Machine Size: 620 × 626 × 1390 mm
- Net Weight: 75 Kg
- Power Supply Input: 100-240 V AC, 50/60 Hz
- Power Supply Output: 24 V DC, 350 W
- Print Technology: FFF
- Print Head System: Dual-head with electronic lifting system
- Filament Diameter: 1.75 mm
- XYZ Step Size: 0.78125, 0.78125, 0.078125 micron
- Print Head Travel Speed: 30-150 mm/s
- Build Plate: Glass Build Plate, Max Temperature 120℃, Silicone Material, Auto-Leveling
- Filament Run-out Sensor: Available
- Supported Materials: Ultrafuse® 316L, Ultrafuse® 17-4 PH
- Layer Height: 0.1-0.25 mm
- Nozzle Diameter: 0.4 mm (Default), 0.6/0.8 mm (Available)
- Max Nozzle Temperature: 300℃
- Connectivity: Wi-Fi, LAN, USB port, Live camera
- Noise Emission: < 55 dB (A) when building
- Operating Ambient Temperature: 15-30℃, 10-65% RH non-condensing
- Storage Temperature: -25℃ to +55℃, 10-90% RH non-condensing
- Filter: HEPA filter with activated charcoal
- EVE Smart Assistant: Available
- Slicing Software: ideaMaker
- Supported File Types: STL/OBJ/3MF/OLTP
- Supported OS: Windows
- Machine Code Type: GCODE
- User Interface: 7-inch Touch Screen, 1024 × 600 resolution
- Network: Wi-Fi, Ethernet
- Power Loss Recovery: Available
- Motion Controller: Atmel ARM Cortex-M4 120 MHz FPU
- Logic Controller: NXP ARM Cortex-A9 Quad 1 GHz
- Memory: 1 GB
- Onboard Flash: 16 GB
- OS: Embedded Linux
- Ports: USB 2.0 × 2, Ethernet × 1
Catalog excerpts
Printer Build Volume (W × D × H) Single Extruder Print Dual Extruder Print Power Supply Input Power Supply Output Print Technology Print Head System Dual-head with electronic lifting system Filament Diameter XYZ Step Size Print Head Travel Speed Build Plate Max Build Plate Temperature Heated Bed Material Build Plate Leveling General Filament Run-out Sensor Supported Materials Layer Height Nozzle Diameter Max Nozzle Temperature Connectivity Noise Emission (Acoustic) Operating Ambient Temperature Storage Temperature Filter EVE Smart Assistant Slicing Software Supported File Types Supported OS Machine Code Type User Interface Network Power Loss Recovery 0.78125, 0.78125, 0.078125 micron 30-150 mm/s Glass Build Plate 120℃ Silicone Auto-Leveling Available Ultrafuse® 316L, Ultrafuse® 17-4 PH 0.1-0.25 mm 0.4 mm (Default), 0.6/ 0.8 mm (Available) 300℃ Wi-Fi, LAN, USB port, Live camera < 55 dB (A) when building 15-30℃, 10-65% RH non-condensing -25℃ to +55℃, 10-90% RH non-condensing HEPA filter with activated charcoal Available ideaMaker STL/ OBJ/ 3MF/ OLTP Windows GCODE 7-inch Touch Screen Wi-Fi, Ethernet Available Screen Resolution Printer Controller Motion Controller Logic Controller Memory Onboard Flash OS Ports NXP ARM Cortex-A9 Quad 1 GHz 1 GB 16 GB Embedded Linux USB 2.0 × 2, Ethernet
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