Catalog excerpts
Printer Build Volume (W × D × H) Single Extruder Print Dual Extruder Print Power Supply Input Power Supply Output Print Technology Print Head System Dual-head with electronic lifting system Filament Diameter XYZ Step Size Print Head Travel Speed Build Plate Max Build Plate Temperature Heated Bed Material Build Plate Leveling General Filament Run-out Sensor Supported Materials Layer Height Nozzle Diameter Max Nozzle Temperature Connectivity Noise Emission (Acoustic) Operating Ambient Temperature Storage Temperature Filter EVE Smart Assistant Slicing Software Supported File Types Supported OS Machine Code Type User Interface Network Power Loss Recovery 0.78125, 0.78125, 0.078125 micron 30-150 mm/s Glass Build Plate 120℃ Silicone Auto-Leveling Available Ultrafuse® 316L, Ultrafuse® 17-4 PH 0.1-0.25 mm 0.4 mm (Default), 0.6/ 0.8 mm (Available) 300℃ Wi-Fi, LAN, USB port, Live camera < 55 dB (A) when building 15-30℃, 10-65% RH non-condensing -25℃ to +55℃, 10-90% RH non-condensing HEPA filter with activated charcoal Available ideaMaker STL/ OBJ/ 3MF/ OLTP Windows GCODE 7-inch Touch Screen Wi-Fi, Ethernet Available Screen Resolution Printer Controller Motion Controller Logic Controller Memory Onboard Flash OS Ports NXP ARM Cortex-A9 Quad 1 GHz 1 GB 16 GB Embedded Linux USB 2.0 × 2, Ethernet
Open the catalog to page 1
