Catalog excerpts
Technical Specifications PRINTER RMF500 Build Volume ( W × D × H ) Single Extruder Print Dual Extruder Print Power Supply Input Print Technology Print Head Filament Diameter XYZ Positioning Resolution 3-Phase 380 V AC 25 A FFF Independent Dual Electric Nozzle Extrusion System 1.75 mm 1, 1, 0.09765 micron Printing Speed Build Platform PEI Build Plate with Vacuum Manifold Max Build Platform Temperature GENERAL Build Platform Material Build Plate Leveling Supported Materials 110°C Aluminum Alloy Auto leveling Raise3D Industrial PA12 CF, Raise3D Industrial PA12 CF Support (PPA CF, PET CF, PPA GF, ABS, PETG, ASA Coming soon) Nozzle Diameter Max Nozzle Temperature Connectivity Operating Ambient Temperature Storage Temperature Slicing Software SOFTWARE Supported File Types Supported OS Machine Code Type User Interface Network 0.6 mm (Default), 0.8 mm (Coming soon) 330°C Wi-Fi, LAN, USB port, Live camera 15-30°C, 30-70% RH Non-Condensing (HOLD) -40°C to +54°C, 10-85% RH Non-Condensing (HOLD) ideaMaker STL/ OBJ/ 3MF/ OLTP Windows/ macOS/ Linux GCODE 13.3-inch Touchscreen Ethernet, Wireless 802.11 b/g/n, Dual Mode Wi-Fi Screen Resolution PRINTER CONTROLLER Motion Controller Logic Controller Memory Rockchip RK3399 ARM Dual Cortex-A72 and Quad Cortex-A53 1.8 GHz 2 GB Onboard Flash Stationsplein 45 Unit A4.004 3013AK Rotterda
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