Overview: The document provides technical specifications for various models of wired and wireless imaging devices, focusing on their technology, image capabilities, power requirements, and operating conditions.
Specifications:- Technology and Scintillator: All models use a-Si technology with CsI scintillators.
- Image Size and Pixel Matrix: Image sizes are either 350×430 mm or 430×430 mm, with pixel matrices ranging from 2304×2800 to 3072×3072.
- Pixel Pitch and A/D Conversion: Pixel pitch is either 139 μm or 150 μm, with 16-bit A/D conversion across all models.
- Spatial Resolution: Ranges from 3.4 lp/mm to 3.6 lp/mm.
- Image Acquisition Time: Wired models acquire images in 1 second, while wireless models take 2 to 2.5 seconds, with some variations up to 5 seconds.
- X-ray Voltage Range: Consistent across models at 40-150kv.
Data Interface and Power:- Data Interface: Wired models use GBE, while wireless models support GBE/802.11ac and IEEE802.11 a/b/g/n/ac.
- Power Dissipation: All models have a power dissipation of 20W.
- Adapter Input/Output: Input is 100-240V, 50-60Hz AC, with an output of 24V DC, 2.5A.
Operating Environment:- Temperature and Humidity: Operating temperatures range from 5-35ºC, with humidity levels between 10-90% RH depending on the model.
Additional Features:- Trigger Mode: Options include AED, Software, and Outer, with some models offering AED as optional.
- Battery Standby: Wireless models offer up to 8 hours of standby time.
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