MS5525DSO
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FEATURES • Small Outline IC Package • Barbed Pressure Ports • Low Power, High Resolution ADC • Digital Pressure and Temperature Outputs APPLICATIONS • Factory Automation • Altitude and Airspeed Measurements • Medical Instruments • Leak Detection MS5525DSO (Digital Small Outline) SPECIFICATIONS • Integrated Digital Pressure Sensor (24-bit AI ADC) • Fast Conversion Down to 1 ms • Low Power, 1 pA (standby < 0.15 pA) • Supply Voltage: 1.8 to 3.6V • Pressure Range: 1 to 30 PSI • I2C and SPI Interface The MS5525DSO is a new generation of Digital Small Outline pressure sensors from MEAS with SPI and I2C bus interface designed for high volume OEM users. The sensor module includes a pressure sensor and an ultra-low power 24-bit AI ADC with internal factory calibrated coefficients. It provides a 24-bit digital pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. The MS5525DSO can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device. This new sensor module generation is based on leading MEMS technology and latest benefits from TE proven experience and know-how in high volume manufacturing of pressure modules, which have been widely used for over a decade. The rugged engineered thermoplastic transducer is available in single and dual port configurations, and can measure absolute, gauge, compound, and differential pressure from 1 to 30psi.

(Digital Small Outline) 002 DB, SB, ST, DH,FT DB, SB,ST, DH 005 DB, SB, ST, DH,FT DB, SB,ST ,DH 015 DB, FB, DH, FT DB, SB, ST, DH,FT DB, DH 030 DB, FB, DH, FT DB, SB, ST, DH,FT DB, DH See Package Configurations: DB= Dual Barb, DH= Dual Hole, SB=Single Barb, ST=Single Tube, FT=Front Side Tube Parameter Supply Voltage Storage Temperature Overpressure Burst Pressure ESD Solder Temperature Conditions Ta = 25°C Ta = 25 °C, both Ports Ta = 25 °C, Port 1 HBM Table 1- BURST PRESSURE BY RANGE AND PORT DESIGNATION. Unit psi psi psi psi psi ENVIRONMENTAL SPECIFICATIONS...

MS5525DSO (Digital Small Outline) Unless otherwise specified: Supply Voltage1 3.0 VDC, Reference Temperature: 25°C PARAMETERS MIN TYP MAX UNITS Operating Voltage 1.8 3.6 Pressure Accuracy Total Error Band (TEB) Temperature Accuracy (Reference Temperature) Temperature Accuracy Supply Current Compensated Temperature Operating Temperature Conversion Time Weight Media See Table 2 Below %FS See OSR Table Below mA See OSR Table Below ms Non-Corrosive Dry Gases Compatible with Silicon, Glass, LCP, RTV, Gold, Thermo-Epoxy, Silicone Gel, Aluminum and Epoxy. See “Wetted...

MS5525DSO (Digital Small Outline) OVERSAMPLNG RATIO (OSR) PERFORMANCE CHARACTERISTICS SUPPLY CURRENT CHARACTERISTICS Parameter Symbol Conditions Min. Typ. Peak supply current during conversion 1.4 Standby supply current at 25°C 0.02 ANALOG DIGITAL CONVERTER (ADC) Parameter Symbol Conditions Min. PRESSURE OUTPUTS (I2C, DOUT) Parameter Symbo Conditions Min. Ty M Unit Output high voltage Voh Isource = 0.6 mA 80% Vdd 100% V Output low voltage Vol Isink = 0.6 mA 0% Vdd 20% Vdd V

MS5525DSO (Digital Small Outline) DIGITAL INTERFACE DIGITAL FILTER OPS OCSB O SDI/SDA OSOQ O SCLK/SCL EXTERNAL CONNECTIONS Figure 1: Block diagram of MS5525DSO GENERAL The MS5525DSO consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5525DSO is to convert the uncompensated analog output voltage from the piezo-resistive pressure sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. FACTORY CALIBRATION Every module is individually factory calibrated at two temperatures and three pressures. As a...

MS5525DSO (Digital Small Outline) I2C MODE & ADDRESSING The external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta). The sensor responds on the same pin SDA which is bidirectional for the I2C bus interface. So this interface type uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board space. In I2C -Mode the complement of the pin CSB (Chip Select) represents the LSB of the I2C address. It is possible to use two sensors with two different addresses on the I2C bus. The pin CSB must be connected to VDD...

(Digital Small Outline) Read Calibration Data from PROM Variable Coefficient Description Recommended Variable Type Example/ Typical Temperature Coefficient of Pressure Sensitivity | TCS Temperature Coefficient of Pressure Offset | TCO Reference Temperature | TREF Temperature Coefficient of Temperature | TEMPSENS Read Digital Pressure and Temperature Data D1 Digital Pressure Value Digital Temperature Value Difference between actual and reference temperature dT = D2 - TRE F = D2 - C5 * 2Q5 Calculate Temperature Compensated Pressure OFF Offset at actual temperature OFF=OFFT1+TCO *...

(Digital Small Outline) Qx Coefficients Matrix by Pressure Range TRES Part Number MEMORY MAPPING Memory Mapping Address Figure 2: Memory PROM Mapping Maximal size of intermediate result during evaluation of variable.

MS5525DSO (Digital Small Outline) SPI INTERFACE RESET SEQUENCE The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into the internal register. It can be also used to reset the device ROM from an unknown condition SCLK CSB SDI SDO PS Figure 5: Reset command sequence SPI mode 0 Figure 6: Reset command sequence SPI mode 3

(Digital Small Outline) CONVERSION SEQUENCE The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. The chip select can be disabled during this time to communicate with other devices. After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and the final result...